The South Korean electronics giant, Samsung, have recently announced they have gone into mass production of the industry’s very first ePoP memory for smartphones. ePoP stands for embedded package on package. The memory module is a single memory package, which has 3GB LPDDR3 DRAM, a 32GB eMMC (Embedded Multi-Media Card) as well as a controller.
The newly designed component is going be used in high-end smartphones. The major selling point of this piece of DRAM hardware is that since it combines all the essential memory components into a single package, it does not take up much space.
In fact the design is so svelte that can be stacked squarely onto a mobile processor. Jeeho Baek, Senior Vice President of Memory Marketing at Samsung Electronics said, “By offering our new high-density ePoP memory for flagship smartphones, Samsung expects to provide its customers with significant design benefits, while enabling faster and longer operation of multi-tasking features.”
The 3GB LPDDR3 mobile DRAM in this element operates at an I/O data transfer rate of 1,866Mb/s and offers 64-bit I/O bandwidth. This is more than capable of satisfying the current market requirements, all the while maintaining efficiency in power, and of course the ultra slim design. It has been said that the space which will be saved could possibly go towards integrating a larger sized battery.
Samsung Electronics has already offered a single-package component solution which has provided very similar solutions for the wearable device market.
Original Equipment Manufacturers (OEMs) are going to be able to purchase the ePoP memory modules directly from Samsung for use in their high-end smartphones. Not to mention the fact that Samsung will be able to utilise this new component in their own smartphones too.
We look forward to seeing just which manufacturers are going to take on this new ePoP memory for smartphones and the kind of transfer rates that will occur in real world devices.